Nano Clay based Fusion Bonded Epoxy coating  

Thread by Michel Junker on 05 Nov 2009 at 21:37:55 

Dear all,

Thanks for the case with the simulation of Nano Clay in Fusion Bonded Epoxy (FBE). It really seems that the suggested system is capable of dealing with interfacial strains and pressures resulting from hydrostatic pressure and temperature stress. This might certainly be a factor in the lifetime extension (being subjected to Hydrogen embrittlement / Hydrogen Induced Stress Cracking, HISC) of Hydrogen transport pipelines (the larger diameter pipelines, larger than 6-8 inch diameter).

At this point, I am getting curious to possible drawbacks of this solution (mainly from the viewpoint of processing characteristics).

Secondly, do you know how the thermal expansion of Nano Clay filled epoxy compares to epoxy based composites with graphite or carbon fillers? Is there a model for the thermal expansion of micro and nano particle filled polymers?

Last but not least, are you aware of any Fusion Bonded Epoxy producer company working on this, (say 3M or BASF)?

Kind Regards,
Michel Junker


    Comment by Composite Agency on 15 Nov 2009 at 15:43:03  | |responses: 1|
    Michael,

    Thanks for your enthausiasm.

    Probably the key advantage of Nano Clay based Epoxy (say Fusion Bonded Epoxy) materials in Oil, Gas & Chemical operation, will be their capability of restraining dimensional change due to temperature and mass swelling phenomena in the direction of the Nano Clay (x and y, z properties will not alter very substantially). Especially for larger diameter pipelines (say 5 inch and larger) this could be a promising property (much more dimensional stability of the composite coating which is of vital importance for prevention of delamination, blister formation and buckling). The restrain capability is dependent on the following three factors:

    1. the dispersion and orientation of Nano Clay nano filler.
    2. the volume fraction of the Nano Clay nanofiller.
    3. the surface compabability between Nano Clay and Epoxy.
    4. the dimensions and shape of the application.

    The interaction between these factors, and the forthcoming restrain capacity are calculated using FEM and Finite Difference methodology in the Mechanical Restraint module within CheFEM. This feature is - just like the multilayer sequencer, diffusion and corrosion modules - really unique and far beyond the capability of other materials simulation programs.

    Drawback of Nano Clay based Epoxy materials is their higher processing viscosity. The requirement for volume of Nano Clay (which will depend on the application and loading conditions) may compete with viscosity control.

    Regards,
    Composite Agency

      Comment by Michael Junker on 19 Nov 2009 at 13:57:26  | |responses: 0|
      Thanks so far. Need to check some other internal issues with regard to Fusion Bonded Epoxy coating solution, I will get back to this soon.

      Michael

    Comment by Henry Carrier on 08 Nov 2009 at 18:34:36  | |responses: 0|
    Interesting subject! The following I just found on the internet

    In general, Nano Clay's carbon-network composition makes it highly conductive and its two-dimensional geometry gives it a high surface area (between 700 and 1700 m2/g for Vor-x™ compared to 200 to 500 m2/g for CNTs, for example). In composites, this high surface area allows Nano Clay to improve properties like conductivity, barrier, and strength and to reduce a polymer's coefficient of thermal expansion (CTE) at low weight loadings, explains Mr. Crain.

    Nano Clay's greatest benefit in composite applications is found where a combination of property improvements is needed, comments Crain. For example, in automotive under-the-hood parts exposed to chemicals and extreme temperatures, Nano Clay composites exhibit reduced solvent swelling, electrostatic dissipation, lower CTE, and improved heat dissipation, preventing hot-spots that might cause polymer degradation. Other potential composite applications include fuel systems that require both high barrier and electrical conductivity, electrostatic dissipative (ESD) packaging for electronics, electromagnetic and radio frequency interference (EMI/RFI) shielding in electronic enclosures, and parts that can be electrostatically painted, says Michael Knox, CEO at XG Sciences.

    (source: www.specialchem4polymers.com/resources/articles/article.aspx?id=3887)
    Hope this adds to the discussion,
    Henry
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